DATE Save the Date 17 to 19 April 2023


Dear DATE community,

We, the DATE Sponsors Committee (DSC) and the DATE Executive Committee (DEC), are deeply shocked and saddened by the tragedy currently unfolding in Ukraine, and we would like to express our full solidarity with all the people and families affected by the war.

Our thoughts also go out to everyone in Ukraine and Russia, whether they are directly or indirectly affected by the events, and we extend our deep sympathy.

We condemn Russia’s military action in Ukraine, which violates international law. And we call on the different governments to take immediate action to protect everyone in that country, particularly including its civilian population and people affiliated with its universities.

Now more than ever, our DATE community must promote our societal values (justice, freedom, respect, community, and responsibility) and confront this situation collectively and peacefully to end this nonsense war.

DATE Sponsors and Executive Committees.


Kindly note that all times on the virtual conference platform are displayed in the user's time zone.

The time zone for all times mentioned at the DATE website is CET – Central Europe Time (UTC+1).

IEEE Solid-State Circuits Society (IEEE SSCS)

IEEE Solid-State Circuits Society (IEEE SSCS)
Contact Person
IEEE SSCS Executive Office
Location

445 Hoes Lane
Piscataway, NJ 08854
United States

SSCS focuses on integrated-circuit career opportunities and education, offering Society members:

  • Journal of Solid-State Circuits
  • Solid-State Circuits Magazine
  • International conferences
  • Webinars on Cutting Edge Topics
  • Online tutorials
  • Local networking at More than 100 Chapters Worldwide

The Society also provides opportunities for student travel and recognition of excellence.

With over 9,000 members around the world, the IEEE Solid-State Circuits Society focuses on fabricated integrated circuit designs -- in contrast to simulated circuits and analyzed models -- for all applications using relevant materials and interconnections.