DATE Save the Date 17 to 19 April 2023


Dear DATE community,

We, the DATE Sponsors Committee (DSC) and the DATE Executive Committee (DEC), are deeply shocked and saddened by the tragedy currently unfolding in Ukraine, and we would like to express our full solidarity with all the people and families affected by the war.

Our thoughts also go out to everyone in Ukraine and Russia, whether they are directly or indirectly affected by the events, and we extend our deep sympathy.

We condemn Russia’s military action in Ukraine, which violates international law. And we call on the different governments to take immediate action to protect everyone in that country, particularly including its civilian population and people affiliated with its universities.

Now more than ever, our DATE community must promote our societal values (justice, freedom, respect, community, and responsibility) and confront this situation collectively and peacefully to end this nonsense war.

DATE Sponsors and Executive Committees.


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The time zone for all times mentioned at the DATE website is CET – Central Europe Time (UTC+1).

W02.4 Session 4: 3D Design, Methodology and Thermal

Session Start
Session End
Session chair
Peter Ramm, Fraunhofer, Germany
Presentations

W02.4.3 EDA Tools and PPA Tradeoff Studies for Micro-bump and Hybrid Bond 3D ICs

Start
End
Speaker
SungKyu Lim, GeorgiaTech, United States

W02.4.2 Heterogeneous Packaging Design and Verification Workflows

Start
End
Speaker
Anthony Mastroianni, SIEMENS EDA, United States

W02.4.4 Towards a Place and Route Flow for High Density 3D-ICs

Start
End
Speaker
Mauricio Altieri, CEA, France

W02.4.1 Challenges and Opportunities for Thermals in Heterogeneous 3D Packaging

Start
End
Speaker
Rajiv Mongia, INTEL, United States