ET6.8.3 Connecting Design, Manufacturing and Assembly in the Moore’s Law 2.0 Era

Dear DATE community,

We, the DATE Sponsors Committee (DSC) and the DATE Executive Committee (DEC), are deeply shocked and saddened by the tragedy currently unfolding in Ukraine, and we would like to express our full solidarity with all the people and families affected by the war.

Our thoughts also go out to everyone in Ukraine and Russia, whether they are directly or indirectly affected by the events, and we extend our deep sympathy.

We condemn Russia’s military action in Ukraine, which violates international law. And we call on the different governments to take immediate action to protect everyone in that country, particularly including its civilian population and people affiliated with its universities.

Now more than ever, our DATE community must promote our societal values (justice, freedom, respect, community, and responsibility) and confront this situation collectively and peacefully to end this nonsense war.

DATE Sponsors and Executive Committees.

Kindly note that all times on the virtual conference platform are displayed in the user's time zone.

The time zone for all times mentioned at the DATE website is CET – Central Europe Time (UTC+1).

ET6.8.3 Connecting Design, Manufacturing and Assembly in the Moore’s Law 2.0 Era

Start

11:45

End

12:10

Speaker

Paul Cohen, SEMI/ESDA, United States

As device scaling predicted by Moore’s Law becomes more difficult and costly, designers are looking towards new solutions to deliver increasing system level functionality and performance along with lower power and cost. The International Technology Roadmap for Semiconductors (ITRS) served as a designer’s guide to upcoming technologies for many years until it’s retirement in 2016. The Heterogeneous Integration Roadmap (HIR) provides a new guideline for system level integration for the coming decades. This includes new technologies which will have an impact on the tradeoffs facing designers. In addition, the increasing use of silicon in products and applications with long lifetimes and critical safety requirements suggests that long term process effects can no longer be safely ignored. All of this requires increased communication amongst all aspects of system design, manufacture, and assembly as we move towards Moore 2.0.